Sonim Partners with FIH Mobile for Next Generation Rugged Feature Phones
March 5, 2021 | PRNewswireEstimated reading time: Less than a minute
Sonim Technologies, Inc., has announced the selection of FIH Mobile, a subsidiary of Foxconn Technology Group, to support the engineering and manufacturing of Sonim's next generation feature phones. These future devices are expected to leverage QUALCOMM chipsets and feature the unique characteristics that have built Sonim's reputation for the most rugged mobile phones available.
"We selected FIH for this important partnership due to its globally recognized comprehensive cell phone design, development and production capabilities, which will enable us to accelerate the deployment of our highest volume devices in a cost-efficient way," said Tom Wilkinson, Chief Executive Officer. "Additionally, by selecting FIH, Sonim's next generation of feature phone devices will be made at facilities in Vietnam and leverage FIH's unique experience in rugged device manufacturing and working with all US Carriers."
Sonim expects to benefit from FIH's integrated ODM services, including hardware, software, certification and manufacturing. Additionally, working with FIH will provide Sonim access to a best-in-class supply chain and manufacturing process. The first devices are expected to come to market in the third quarter of 2021.
Suggested Items
Nolan’s Notes: Coming to Terms With AI
05/07/2024 | Nolan Johnson -- Column: Nolan's NotesHow fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then I went to IPC APEX EXPO and upended it all. I originally had compared AI to drag racing in that (CPU) horsepower and new (data) vehicles have steadily delivered higher performance competition. That seemed pretty accurate given how generative AI models dominated the popular media with amazing results—and sometimes spectacular crashes.
DDM Novastar Unveils Affordable NovaPlace Automatic Pick and Place Systems
05/06/2024 | DDM Novastar Inc.DDM Novastar, a prominent U.S. manufacturer specializing in SMT and PCB assembly equipment, proudly announces the recent launch of their NovaPlace Pick & Place systems. This new line introduces entry-level yet high-performance pick and place machines.
May Issue of SMT007 Magazine: Coming to Terms With AI
05/06/2024 | I-Connect007 Editorial TeamIn the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.