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TABLE OF CONTENTS

NEWS

RESOURCES

REGIONS

SPECIAL EVENTS

Assembly

Cleaning

Market News

Medical

Mil/Aero

Printing

RoHS & Lead-Free

Soldering

Test & Inspection

February 2012 FLIP

February 2012 PDF

2012 Magazines

2011 Magazines

2010 Magazines

DIRECTORIES

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WHITE PAPERS

An Electrically Conductive Adhesive with Bottom Line Benefits (Henkel, Nov. 2011)

Reliability that Sticks: Thermal Adhesive Films (Henkel, Sept. 2011)

Automotive Materials Solutions (Henkel, August 2011)

Wave Soldering Adapts With New Flux Technology (Henkel, June 2011)

Thermal Solutions for Any Application (Henkel, Jan. 2011)

Halides, Halogens, It's All the Same, Right? Think Again! (Henkel, Dec. 2010)

Printed Electronics: Traditional Technology Addresses Today's Smaller, Faster, Lower Cost Requirements (Henkel, Nov. 2010)

Thermal Management Materials Get a Grip (Henkel, Sept. 2010)

Macromelt Chosen for Next-Gen Hybird Vehicle (Henkel, Aug. 2010)

No Need for Sour Grapes (Henkel, July 2010)

INDUSTRY SUPPLIERS

Cleaning Products & Services

Distributors (EMS)

Christopher Associates

Solder Supplies

		Heraeus CMD

		Indium Corp.

		P Kay Metal

SMT Equipment

		APS Novastar

		Essemtec AG

		Fuji Machine Manufacturing Co., Ltd.

		Goepel electronic GmbH

		Henkel

		Manncorp

		Nordson ASYMTEK

Training & Education

		Blackfox Training & Certification

		EPTAC Corporation

INTERESTING WEBSITES

PCB FAB & ASSEMBLY

		All Flex

		Cirexx Intl

		Epec Engineered Technologies

		Hunter Technology

		Lenthor Engineering

		Microart Services, Inc.

ASSOCIATIONS

		American National Standards Institute (ANSI)

		Defense Supply Center (DSCC)

		EIPC (Europe)

		Electronic Industries Alliance (EIA)

		International Electronics Manufacturing Initiative (iNEMI)

		International Electrotechnical Commission (EIC)

		International Engineering Consortium (IEC)

		International Microelectronics & Packaging Society (IMAPS)

		International Organization for Standardization (ISO)

		IPC - Association Connecting Electronics Industries

		IPC Designers Council

		Japan Electronics Packaging & Circuits Assoc. (JPCA)

		Jisso Council (JEITA)

		Joint Electron Device Engineering Council (JEDEC)

		Korea Printed Circuit Association (KPCA)

		Microelectronics Packaging & Test Eng. Council (MEPTEC)

		National Assoc. of Manufacturers (NAM)

		National Electronic Distributors Assoc. (NEDA)

		Organic Electronics Association (oe-a)

		Semiconductor Industries Assoc. (SIA)

		Surface Mount Technology Assoc. (SMTA)

		Taiwan Printed Circuit Association (TPCA)

		Verband der Leiterplattenindustrie (VdL)

		World Electronics Circuits Council (WECC)

		ZVEI Electronics Components and Systems

BOOKS

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