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|  | BAE Systems to Enhance Capability of Finnish Air Force Tuesday, September 07, 2010 | BAE Systems BAE Systems has been awarded a contract to provide a Link 16 network management system to the Finnish Air Force. Supporting the operation of Finland's F-18 aircraft, the system will enable ground command and control operators to connect to, and maintain contact with, their fast jets across the entire country.
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 |  | Fake Chips Everywhere Monday, September 06, 2010 | MercuryNews.com It's not just the military that's at risk. Chips perform key roles in countless commercial products, as well as phone links, banking networks, electronic grids and nuclear power plants. Given the flood of phony chips, counterfeit parts can be found everywhere.
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|  | Northstar Inks Another Order from Lockheed Martin Friday, September 03, 2010 | Business Wire Northstar Electronics, Inc. today announced that its wholly owned subsidiary, Northstar Network Ltd., has received a revised Master Purchase Order from Lockheed Martin to increase the value of NNL's P-3 contract by US $9.1 million, to a total of US $16.4 million.
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|  | BAE Systems to Develop On-Board Processor, Integrate ARGUS-IR Thursday, September 02, 2010 | BUSINESS WIRE After successful development of the Defense Advanced Research Projects Agency's (DARPA) daytime persistent surveillance system, BAE Systems has been awarded an additional $49.9 million contract to develop the advanced processor for the agency's nighttime, infrared system - the Autonomous Real-time Ground Ubiquitous Surveillance - Infrared (ARGUS-IR).
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|  | Russia Defence and Security Report 4Q10 Thursday, September 02, 2010 | BUSINESS WIRE Research and Markets has announced the addition of the "Russia Defence and Security Report Q4 2010" report to their offering.
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|  | Harris Awarded AMRAAM Missile Telemetry Modules Contract Thursday, September 02, 2010 | PRNewswire Harris Corporation, an international communications and information technology company, has been awarded a 2 1/2 year, $18 million contract to produce telemetry modules supporting the U.S. Air Force Advanced Medium-Range Air-to-Air Missile (AMRAAM).
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|  | TiaLinx Launches Eagle45-W Thursday, September 02, 2010 | PRNewswire TiaLinx, Inc., a developer of miniaturized mm-wave radars with integrated radio and antenna arrays, today announced the launch of the Eagle45-W, a hands-free precision Sense-Through-the-Wall Imager.
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|  | Elbit Systems to Acquire Mikal Shares of Soltam, Saymar and ITL Thursday, September 02, 2010 | PRNewswire Elbit Systems Ltd. announced today, further to its announcements of June 15, 2009 and September 14, 2009, that it signed an agreement to acquire all the shares of Soltam Systems Ltd., Saymar Ltd. and ITL Optronics Ltd., that are currently held by Mikal Ltd. and its subsidiaries.
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 |  | LaBarge: Q4 Net Earnings Up 85% Thursday, September 02, 2010 | Business Wire "Outstanding operational performance and increased customer demand across most key market sectors propelled LaBarge’s sales and earnings to record levels in the company’s fiscal 2010 fourth quarter and full year," said Craig LaBarge, CEO and President.
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 |  | The Shaughnessy Report: HDI Class Q&A with Dan Smith Tuesday, August 24, 2010 | Andy Shaughnessy, PCBDesign007 Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump."
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 |  | EMS Market Recovery Boosts Neways' Growth 25% Wednesday, August 25, 2010 | Neways Electronics International N.V. Neways Electronics International N.V. (Neways) recorded a fully organic increase in net turnover of approximately 25% in the first half of 2010 compared to the first half of 2009. This strong increase was due to a clear and broad-based rise in demand in the EMS market.
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|  | Embedded Die Assembly for High-Rel Applications Thursday, August 19, 2010 | Real Time With...IPC APEX Expo 2010  Casey Cooper, Microelectronics Lab Manager at STI, talks about the company's various educational, training and technology offerings and provides an overview of the company's newly-developed and tested embedded die assembly. The new assembly is being evaluated by some military product developers for high-reliability applications.
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|  | PWB Barrel Cracks: Wear-Out Failures Wednesday, May 05, 2010 | Paul Reid, PWB Interconnect Solutions Developers of mil/aero and other high-rel applications depend on solid failure analysis. Paul Reid discusses how thermal cycling will cause a robust plated through-hole to crack slowly over time. Plotting a resistance graph of damage accumulation allows technologists to determine onset, rate of accumulation and whether the damage is accelerating linearly or exponentially.
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 |  | API Technologies Posts 378% Revenue Growth in Q4 Wednesday, August 11, 2010 | API Technologies "I am very pleased with our fourth quarter results as API had the strongest quarter in the company's history," said CEO, Stephen B. Pudles. "Our acquisition strategy and cost-cutting initiatives have shown considerable success and have enabled the company to achieve positive net income, which we expect to continue into fiscal 2011."
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 |  | Suntron: Perfect Score for AS9100 Audits Monday, August 02, 2010 | Marketwire Suntron Corporation's Phoenix facility has received a perfect score on four consecutive semi-annual surveillance audits required by the AS9100 aerospace quality management certification.
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 |  | Teledyne Acquires Labtech Microwave Thursday, July 29, 2010 | Teledyne Technologies Inc., "By expanding our presence in Europe, Labtech is a welcome addition to our portfolio of businesses," said Russell Shaller, VP and GM of Teledyne MEC. "Coupled with our Teledyne Cougar microwave component business in the U.S., Labtech's component business augments our already strong position in the field of custom, high-performance microwave components."
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|  | Timing is Everything in Controlled Impedance Fabrication Tuesday, July 20, 2010 | Mark Thompson, CID, Prototron Circuits According to Mark Thompson, timing can make or break your controlled impedance board. With many jobs going through turnkey environments, late communication about impedance issues takes valuable time out of the fabrication process and can delay delivery of product, leaving the end-user and the turnkey assembler unhappy.
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 |  | IEC Enjoys 50% Revenue Bump in Fiscal 3Q10 Monday, July 19, 2010 | Marketwire W. Barry Gilbert, Chairman of the Board and CEO, said, "This was an especially good quarter. Operating profit of over 8.5% of sales is unique in our industry. Sales growth of more than 50% and operating profit growth of more than 70%, as compared to the third quarter of fiscal 2009, were especially gratifying.
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|  | Counterfeit Material Prevention and Detection Tuesday, August 31, 2010 | SMT Magazine Archive In this article, Paul Bodmer, Bruce Tostevin and Scott Mazur, Benchmark Electronics Inc., detail the methods used to prevent and detect counterfeit components for various industries such as telecommunications, military and aerospace. The objective is preventing counterfeit components and material from propagating into the manufacturing process.
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 |  | The Shaughnessy Report: HDI Class Q&A with Dan Smith Tuesday, August 24, 2010 | Andy Shaughnessy, PCBDesign007 Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump."
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|  | Embedded Die Assembly for High-Rel Applications Thursday, August 19, 2010 | Real Time With...IPC APEX Expo 2010  Casey Cooper, Microelectronics Lab Manager at STI, talks about the company's various educational, training and technology offerings and provides an overview of the company's newly-developed and tested embedded die assembly. The new assembly is being evaluated by some military product developers for high-reliability applications.
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|  | PWB Barrel Cracks: Wear-Out Failures Wednesday, May 05, 2010 | Paul Reid, PWB Interconnect Solutions Developers of mil/aero and other high-rel applications depend on solid failure analysis. Paul Reid discusses how thermal cycling will cause a robust plated through-hole to crack slowly over time. Plotting a resistance graph of damage accumulation allows technologists to determine onset, rate of accumulation and whether the damage is accelerating linearly or exponentially.
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 |  | Lead-Free in Mission Critical: Failure Is Not An Option Wednesday, August 11, 2010 | Grant Peterson, Vice President, Electronic Controls Design To confidently use lead-free in high-reliability applications, especially considering the EU drive to impose RoHS on some areas currently exempt, it seems prudent to step back and determine where we are, how we got here and what remains to be done.
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 |  | Component Performance Rising with Energy Requirements Wednesday, August 11, 2010 | Craig Hunter, Vishay Intertechnology Components that work as expected, and when required, are very important in general, and especially in harsh environments. After all, electronic systems are being used everywhere, from many thousands of feet underground or underwater to outer space.
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|  | Section 10: BGAs Re-Balled Wednesday, August 04, 2010 | Tom Clifford, Consultant These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 10 includes images of re-balled collapsing and non-collapsing C-BGAs, compromised fillets, mis-registered balls and more.
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|  | Timing is Everything in Controlled Impedance Fabrication Tuesday, July 20, 2010 | Mark Thompson, CID, Prototron Circuits According to Mark Thompson, timing can make or break your controlled impedance board. With many jobs going through turnkey environments, late communication about impedance issues takes valuable time out of the fabrication process and can delay delivery of product, leaving the end-user and the turnkey assembler unhappy.
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 |  | Exploring ITAR's Future and Present Tuesday, July 13, 2010 | Terry Costlow, IPC There's a chance that International Traffic in Arms Regulation (ITAR) and other regulations that dictate how North American companies handle controlled products will undergo dramatic alterations in the next few years.
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 |  | The Shaughnessy Report: HDI Class Q&A with Dan Smith Tuesday, August 24, 2010 | Andy Shaughnessy, PCBDesign007 Is North America falling behind the rest of the world in HDI technology development? Not if Dan Smith can help it. "The New Mr. HDI" is putting together the first IPC HDI certification course and exam. We caught up with him and discussed the HDI course, what it takes to be an instructor and Happy Holden's 400-gig "data dump."
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|  | PWB Barrel Cracks: Wear-Out Failures Wednesday, May 05, 2010 | Paul Reid, PWB Interconnect Solutions Developers of mil/aero and other high-rel applications depend on solid failure analysis. Paul Reid discusses how thermal cycling will cause a robust plated through-hole to crack slowly over time. Plotting a resistance graph of damage accumulation allows technologists to determine onset, rate of accumulation and whether the damage is accelerating linearly or exponentially.
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|  | Timing is Everything in Controlled Impedance Fabrication Tuesday, July 20, 2010 | Mark Thompson, CID, Prototron Circuits According to Mark Thompson, timing can make or break your controlled impedance board. With many jobs going through turnkey environments, late communication about impedance issues takes valuable time out of the fabrication process and can delay delivery of product, leaving the end-user and the turnkey assembler unhappy.
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 |  | Is There an Incipient Rebellion Against Lead-Free Solder? Tuesday, February 2, 2010 | Harvey Miller, IConnect007 IPC's Technet offers a snapshot of the issues of the day as hundreds of engineers attempt to sort out the industry's latest technological challenges. Harvey Miller, PCB007 columnist and President of Fabfile Online, has agreed to gather a few of the latest Technet exchanges for our Tech Tuesday readers.
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 |  | The Gold Record: IPC Sticks to Game Plan in 2010 Friday, January 29, 2010 | Steve Gold, I-Connect007 Perhaps no other organization in our industry polarizes people like IPC. For some, the association can do no right; others behave more like Obama volunteers walking lock-step with the president no matter what public approval ratings and unemployment statistics say.
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 |  | IPC Goes to Washington, Talks Military Tuesday, December 15, 2009 | Ray Rasmussen, I-Connect007 It was a star-studded conference with fabricators looking to the government for support to develop the technologies needed along with commitments to strengthen the supply chain, while the government looked to the industry for solutions to its counterfeit components, reliability and supply chain security.
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|  | Bipartisan Effort Produces Results in Washington Tuesday, December 15, 2009 | Al Wasserzug - The Wasserzug Report By bipartisan, I'm referring to the military customers and manufacturers of rigid and flex circuits who attended IPC's conference on "The North American PCB Industry: It Can and Will Support the Military Market." Learn why cooperation like this is so vital to the survival of the NA PCB industry.
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 |  | IPC Executive Forum: Solar Gets Slammed Thursday, October 29, 2009 | Ray Rasmussen, I-Connect007 It was surprising for most (for sure, for me) in the audience to hear someone so close to the solar industry express so much cynicism. That's just what Paula Mints, Principal Analyst for market research firm PV Services, which has focused on the solar industry for the past 20 years, delivered to the audience.
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