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NEWS    September 7, 2010
PAGE 1 of 471.     NEXT 10 RESULTS
 
NewJTAG Technologies Releases On-Board Test Control Solution
Tuesday, September 07, 2010 | JTAG Technologies    
JTAG Technologies' new support package is intended for board-level and system designers looking to implement a convenient Built-In Test access for boundary-scan testing and on-board device (re)programming.
NewKyzen to Exhibit at IPC Electronics Midwest
Tuesday, September 07, 2010 | Kyzen    
Kyzen will showcase AQUANOX® A4703 Neutral pH Aqueous Cleaning Chemistry in booth #7814 at the upcoming IPC Electronics Midwest Conference & Exhibition, scheduled to take place September 28-30, 2010 at the Donald E. Stevens Convention Center in Rosemont, Illinois.
Salvitech, Gardien Ink Global Distribution Agreement
Monday, September 06, 2010 | CJ Salvitech SL    
Gardien Group has been appointed as the sole distributor of Salvitech's entire Evolution Product line for the areas of North America (USA and Canada) (Europe excluding Italy and Spain, which are managed directly by CJ Salvitech SL) Russia, Africa, Korea, Singapore, Malaysia, Vietnam, India, Japan and Australia.
Electrolube Sets Up New HQ at Leicestershire
Monday, September 06, 2010 | Electrolube    
Despite the current economic climate, Electrolube is expanding and positioning itself for continued growth with the move to an impressive 62,000 sq. ft. facility in Ashby de la Zouch, Leicestershire.
Digi-Key Exceeds $1 Billion in Sales
Monday, September 06, 2010 | Business Wire    
"Digi-Key has grown by an average of 15% each year since 1987. This is real, organic growth--not the result of acquisition, but growth based on Digi-Key's expanded reach to customers around the globe," said Mark Larson, President and COO.
Sono-Tek Names Brian Booth Sales Manager
Friday, September 03, 2010 | PRLog    
Sono-Tek Corporation, the world leader in the development and application of ultrasonic coating systems for spray fluxing, has appointed Brian Booth as Regional Sales Manager for Latin America.
Nordson DAGE Launches Next-Gen Bond Testing Paragon Software
Friday, September 03, 2010 | Nordson DAGE    
Nordson DAGE, a subsidiary of Nordson Corporation and the industry leader in bond testing technology, introduces Paragon, market-leading intelligent bond testing software.
Sonoscan Introduces P300 FastLine C-SAM System
Friday, September 03, 2010 | Sonoscan    
Someone has already called the P300 "a super-fast process checker" for production line environments--meaning that it can very quickly scan and report on a tray of parts, looking at desired depths and giving the images and data that are needed from each depth for every part.
Electronics Midwest Features Live Assembly Line
Friday, September 03, 2010 | IPC    
The Electronics Assembly Suppliers' Initiative (EASi) Line will feature twelve of the industry's top suppliers, with on-site experts available to talk about the EASi-Line's state-of-the-art processes, materials and equipment.
DYMAX Receives Connecticut Quality Improvement Awards
Friday, September 03, 2010 | DYMAX Corporation    
DYMAX Corporation has been awarded two gold Connecticut Quality Innovation Prizes for 2010. The CQIA, founded in 1987, recognizes Connecticut manufacturing and service companies that excel in managing quality improvement for business success and growth.
FEATURES    September 7, 2010
PAGE 1 of 8.     NEXT 10 RESULTS
 
Digi-Key Exceeds $1 Billion in Sales
Monday, September 06, 2010 | Business Wire    
"Digi-Key has grown by an average of 15% each year since 1987. This is real, organic growth--not the result of acquisition, but growth based on Digi-Key's expanded reach to customers around the globe," said Mark Larson, President and COO.
Electronics Midwest Features Live Assembly Line
Friday, September 03, 2010 | IPC    
The Electronics Assembly Suppliers' Initiative (EASi) Line will feature twelve of the industry's top suppliers, with on-site experts available to talk about the EASi-Line's state-of-the-art processes, materials and equipment.
Nordson Posts All-Time Record Profit in Fiscal 3Q10
Friday, August 20, 2010 | Business Wire    
"Our outstanding performance in the quarter clearly demonstrates that we are winning in the marketplace, capturing returning demand and serving our customers with a more efficient model," said Nordson President and Chief CEO, Michael F. Hilton. "The global team has been very prudent in managing expenses while continually meeting our customers' expectations."
LPKF Details 3-D Structuring Business
Wednesday, June 09, 2010 | Real Time With...IPC APEX Expo 2010    
Stephan Schmidt, President of LPKF's North American Business, outlines his company's booming 3-D structuring business and how the same drive toward miniaturization has led to opportunities in laser-based de-paneling.
What is Resolution?
Tuesday, June 08, 2010 | Igor Sosman and Adam Shaw, ORPRO Vision R&D    
In this paper, from ORPRO Vision, the authors explain the concept of magnification and resolution for automated optical inspection (AOI) systems. The concepts described are common to all Machine Vision systems making use of an objective or lens and camera or sensor.
Henkel Reports Positive Q1 Results; Sales Up 7.8%
Thursday, May 06, 2010 | Henkel    
In the first quarter of 2010, Henkel generated sales of 3,512 million euros. In a recovering market environment, this constitutes an increase of 7.8% compared to the figure for the prior-year quarter. Henkel is confident of again outperforming its relevant markets in terms of organic sales growth.
OEM International Sells Production Tech Operations
Friday, April 30, 2010 | Business Wire    
The company markets production equipment for PCBs to the electronics industry in the Nordic and Baltic countries. The acquisition is an asset deal where ElektronikGruppen assumes stock of goods, equipment, customer and supplier deals, as well as intellectual property.
DfR Solutions, ARINC Announce Partnership
Monday, April 05, 2010 | DfR Solutions    
DfR Solutions and ARINC today announced that the two companies have created a partnership to provide combined reliability and DMSMS support to the commercial government and defense industries.
EIPC Speednews: European Institute of Printed Circuits
Tuesday, January 19, 2010 | EIPC    
The European Institute of Printed Circuits (EIPC) will hold the "EIPC-EBFRIP Workshop," to discuss implications and threats of the RoHS recast for the PCB sector, January 21, 2010.
Nordson Acquires German Distributor GLT mbH
Wednesday, January 06, 2010 | Business Wire    
Nordson Corporation has acquired German distributor GLT mbH based in Pforzheim, Germany. GLT has been a distributor of the company's Nordson EFD brand dispensing systems and related products in Germany since 1977.
ARTICLES    September 7, 2010
PAGE 1 of 6.     NEXT 10 RESULTS
 
LPKF Details 3-D Structuring Business
Wednesday, June 09, 2010 | Real Time With...IPC APEX Expo 2010    
Stephan Schmidt, President of LPKF's North American Business, outlines his company's booming 3-D structuring business and how the same drive toward miniaturization has led to opportunities in laser-based de-paneling.
What is Resolution?
Tuesday, June 08, 2010 | Igor Sosman and Adam Shaw, ORPRO Vision R&D    
In this paper, from ORPRO Vision, the authors explain the concept of magnification and resolution for automated optical inspection (AOI) systems. The concepts described are common to all Machine Vision systems making use of an objective or lens and camera or sensor.
Bringing Conformal Coating to the Production Line
Wednesday, February 24, 2010 | Nordson YESTECH    
As demand for increasing quality, lifetime and environmental resilience is placed on electronics PCBs in greater volume and wider applications, conformal coating is now typically a standard process rather than an exotic special treatment.
The Gold Record: Manncorp's Focus on Vertically-Integrated OEMs
Thursday, February 11, 2010 | Steve Gold, I-Connect007    
Henry Mann, Manncorp's President and CEO, examines his company's view of the current EMS capital equipment market. Recognizing there are many smaller, vertically-integrated OEMs, the company has introduced seven new turnkey systems designed for such companies desiring to keep assembly in-house.
Internepcon Japan: Embedded Technology Coming of Age?
Thursday, January 21, 2010 | Steve Gold, I-Connect007    
A Tokyo phone interview with the President of Christopher Associates, Matt Holzmann, delves into the goings on at Internepcon Japan. Find out how the Japanese are pushing the HDI envelope, as the movement to circumvent substrates by embedding chips and components into circuit boards gains momentum.
Underfill's Effect on Lead-Free Area Array Devices
Wednesday, December 30, 2009 | Real Time With...SMTAI    
Find out how underfill systems can enhance the reliability of lead-free area array devices in this interview with Brian Toleno, Henkel's Director of Technical Services.
Focusing on Fine Pitch Stencil Printing
Monday, December 28, 2009 | Real Time With...SMTAI    
Indium Technical Support Engineer Chris Anglin discusses a first-time focus on blade angle for better control of the print process and looks at how to get the entire print process under control.
Understanding Package-on-Package Materials Issues
Monday, December 28, 2009 | Real Time With...SMTAI    
Jim Hisert, Indium Corporation's Applications Engineer, reviews the content of his SMTAI 2009 paper presentation. He discusses Package-on-Package (PoP) materials evaluation criteria and other insights gleaned from his research.
The Sales Cycle: Is China Closed?
Thursday, December 17, 2009 | Barry Matties, The Sales Cycle    
If you're an equipment supplier and not already doing business in China, it may be too late to penetrate this market.
Pushing the PCBA Inspection Envelope
Friday, November 20, 2009 | Real Time With...productronica 2009    
Having released a new machine earlier this year at NEPCON China, VI Technology did not rest on its laurels. Chief Commercial Officer, Jean-Yves Gomez, elaborates on his company's newest equipment release. He also offers his perspective of how the EMS sector is doing.
COLUMNS    September 7, 2010
The Gold Record: Manncorp's Focus on Vertically-Integrated OEMs
Thursday, February 11, 2010 | Steve Gold, I-Connect007    
Henry Mann, Manncorp's President and CEO, examines his company's view of the current EMS capital equipment market. Recognizing there are many smaller, vertically-integrated OEMs, the company has introduced seven new turnkey systems designed for such companies desiring to keep assembly in-house.
Internepcon Japan: Embedded Technology Coming of Age?
Thursday, January 21, 2010 | Steve Gold, I-Connect007    
A Tokyo phone interview with the President of Christopher Associates, Matt Holzmann, delves into the goings on at Internepcon Japan. Find out how the Japanese are pushing the HDI envelope, as the movement to circumvent substrates by embedding chips and components into circuit boards gains momentum.
The Sales Cycle: Is China Closed?
Thursday, December 17, 2009 | Barry Matties, The Sales Cycle    
If you're an equipment supplier and not already doing business in China, it may be too late to penetrate this market.
The Sales Cycle: Where Do Leads Come From?
Tuesday, July 07, 2009 | Barry Matties, The Sales Cycle    
All sales leads are not created equal. And fishing for leads can be frustrating, especially when you're fishing in the same lake as everybody else. Learn how you can you make sure you're casting your net in the right waters.
Who's Driving Your Boat?
Thursday, July 02, 2009 | Al Wasserzug, Vulcan Electronic    
Your company is a lot like a boat at sea. Well, who's driving that boat? Your answer could explain why you're either cutting through choppy waves or dead in the water.
The Sales Cycle: Taking the Risk Out of the Deal
Monday, April 13, 2009 | Barry Matties, I-Connect007    
Eliminating risk is a key to making sales. This is especially true in our industry, where capital-intensive purchases are often the norm. What is the risk for your buyers, and how will you help them overcome these obstacles?
Conductive Inkjet Technology: The Story Behind the News
Tuesday, November 11, 2008 | Pete Starkey, IConnect007    
Conductive Inkjet Technology (CIT) made headlines recently when they hosted an open house at their Cambridge, UK facility, as part of the IDTechex RFID Europe Conference, and demonstrated their latest Metal Jet 6000 system. I-Connect 007's Pete Starkey visited CEO Chris Malley to learn more of the story behind the news.
MS2 Users Discuss New Product Results
Thursday, October 26, 2006 | PCB007 - Steve Gold    
Three new users of a new dross reduction chemical discuss whether or not the product lives up to its hype.
Proof of Design - What To Build And How To Build It Starting With The Stencil Printing Process
Monday, January 16, 2006 | Earl Moon    
Never should anyone select a component, design a board, use a supplier, or think about a process until all DFM team members have been consulted about their objective opinions concerning how a design may be proven as meeting its intent
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