The DEK team is currently preparing for the launch of its new ProActiv technology, being billed as one of the company's most important technology breakthroughs of recent years. To support the launch, DEK will be highlighting ProActiv's ability to revolutionize paste transfer efficiency with an exclusive Webinar, September 24-27, 2010.

A new line of rework systems, ranging from manually assisted models for video game repair to versatile, fully automatic versions with split vision, can now be seen at manncorp/smt/rework.com.

Milara Inc., a leader in stencil printing technological innovation, has appointed Laryo as its representative throughout Italy.

ITAR documents FCT's dedication to adhering to the regulations that control the import and export of defense-related articles and services on the United States Munitions List. FCT also updated its registration for ISO 9001:2008.

APS Novastar is pleased to announce the release of a new video covering its SPR line of Stencil Printers for PCB assembly. Reviewing the complete SMT Stencil Printer product line, the video features the company's newest model, the recently released SPR-45VA Stencil Printer with SMTrue Vision Assist.

This paper outlines the process associated with soldering stacked packages using dip flux and dip solder pastes specifically designed to overcome the incidence of package warp. Based on the process issues involved, inspection results are presented to better illustrate the challenges in implementing PoP into production.

DEK Solar has announced the appointment of Steve Fuszard as its new Production Team Leader. The move is part of the division's drive to fully integrate the build of its metallization platforms into the successful Lean Manufacturing Build Programme now proven throughout the DEK organisation.

DEK has appointed Lean Six-Sigma Black Belt Liang Zong as its new Business Improvement Engineer. She will be responsible for boosting companywide efficiency through lean business improvement initiatives.

Pneumatic dispensing valves mounted on SMT pick-and-place machines were just a useful accessory to save expensive stencils when producing prototypes before; but the application range is much wider now as modern SMD placement machines also can be combined with high-tech metering systems.

Christopher Associates is proud to have sponsored a recent study conducted by noted industry expert Chrys Shea. The research identified the root causes of defects in the stencil printing process.

This paper outlines the process associated with soldering stacked packages using dip flux and dip solder pastes specifically designed to overcome the incidence of package warp. Based on the process issues involved, inspection results are presented to better illustrate the challenges in implementing PoP into production.

Many differences exists between PoP pastes and the traditional solder pastes. This paper highlights those differences and discusses the characteristics needed by PoP pastes to increase transfer efficiency, eliminate head-in-pillow defects and provide excellent solder wetting.

Stephan Schmidt, President of LPKF's North American Business, outlines his company's booming 3-D structuring business and how the same drive toward miniaturization has led to opportunities in laser-based de-paneling.

PowerstrateXtreme is Henkel's new printable phase change thermal interface material that allows for precise thickness control and automated processing via a stencil printing process. Technical Service Director Dr. Brian Toleno explains the relevance of this thermal management material and its industry benefit.

The popularity of HDI is rising. Solder jet printing and cold attachment rival traditional solder printing. Manufacturers are building smaller and smaller quantities--even batches of one! What does this all mean for traditional AOI? Part II of this paper discusses the strengths and weaknesses of AOI given significant changes in PCB materials and manufacturing methods.

The world is ready for fuel cell technologies - more people are concerned with environmental damage from burning fossil fuels.

A definite learning curve exists when ordering the stencil for a printing process. When familiarization with its technologies helps produce desired results, the stencil becomes a constant in an otherwise variable assembly operation.

Trade shows and conferences are vital to the PCB assembly world. Where else can you meet so many potential customers and suppliers? Still, you can't make every industry event, and if you can’t be there, our Real Time With... video coverage is the next best thing to being there.

I-Connect007's Real Time with... has produced over 3,000 video interviews, conference presentations and product reviews at major events around the world. Past events include IPC APEX Expo, productronica, IPC Midwest, SMTA International, Mexitronica, NEPCON China and many more.

Many differences exists between PoP pastes and the traditional solder pastes. This paper highlights those differences and discusses the characteristics needed by PoP pastes to increase transfer efficiency, eliminate head-in-pillow defects and provide excellent solder wetting.

Stephan Schmidt, President of LPKF's North American Business, outlines his company's booming 3-D structuring business and how the same drive toward miniaturization has led to opportunities in laser-based de-paneling.

These new products include automatic conformal coating inspection; electrically conductive adhesive to replace solders; a line of coating cure ovens; a radiometer for light cure; fine-structure screen printer; a valve actuator; and dispensable TIM.

PowerstrateXtreme is Henkel's new printable phase change thermal interface material that allows for precise thickness control and automated processing via a stencil printing process. Technical Service Director Dr. Brian Toleno explains the relevance of this thermal management material and its industry benefit.

Henkel launched Multicore LF620 no-clean lead-free solder paste; Kester announces its NXG1-HF lead-free no-clean solder paste; FCT Assembly debuted NL9302 no-clean, lead-free, halide-free solder paste; and Seika Machinery Inc. brought on board a Solder Paste Recycling Unit.

The popularity of HDI is rising. Solder jet printing and cold attachment rival traditional solder printing. Manufacturers are building smaller and smaller quantities--even batches of one! What does this all mean for traditional AOI? Part II of this paper discusses the strengths and weaknesses of AOI given significant changes in PCB materials and manufacturing methods.

DEK debuted an enclosed print head; Christopher Associates brought out a precision mixer, Ovation released a Gold version of its Grid-Lok fixturing; Asymtek debuted dual simultaneous jetting, and DYMAX introduced a curing wand.

Miguel A. Lara, Celestica, examines solder paste deposition for designs with miniature/fine-pitch and large components. This paper presents the results of solder paste deposition with an alternate post-process operation to SMT stencils that is claimed to improve paste release and consistency. There are two analyzed outputs: solder paste brick height and volume. Variation, normality, and process capability analysis is measured for electroformed and nanocoated laser-cut stencils in identical operations.

Over the past 20 years, the size of electronic packages has continued to shrink as the density of I/O leads has increased.