There is no doubt that everyone in this industry is geared up for continuous improvement. However, far too many overlook one very important process and, unfortunately, the following scenario--described by Dr. Wack of ZESTRON--is repeated with alarming frequency.

JTAG Technologies' new support package is intended for board-level and system designers looking to implement a convenient Built-In Test access for boundary-scan testing and on-board device (re)programming.

Someone has already called the P300 "a super-fast process checker" for production line environments--meaning that it can very quickly scan and report on a tray of parts, looking at desired depths and giving the images and data that are needed from each depth for every part.

In this study, the authors research low-residue and lead-free flux structures, identify solvent compositions that will dissolve these residue types and offer options for performing both bulk and site-specific ionic cleanliness testing methods. Don't miss Part II of this exciting research.

TTCI will be featuring a stand-alone and joint test solution - the Flying Probe & In-Circuit Test - at the upcoming SMTAI 2010 exhibition and conference in Orlando, Florida.

MIRTEC, the "Market Leader in Inspection Technology," has released PowerPoint presentations for each product series featured on its Web site.

The reviews are in--and we're not talking about the latest summer blockbuster. Just one month after acquiring SMT Magazine, I-Connect007 published its first issue of the magazine. The feedback from loyal SMT readers has been overwhelmingly positive. SMT Magazine is just one example of what we have planned for the future.

"Our outstanding performance in the quarter clearly demonstrates that we are winning in the marketplace, capturing returning demand and serving our customers with a more efficient model," said Nordson President and Chief CEO, Michael F. Hilton. "The global team has been very prudent in managing expenses while continually meeting our customers' expectations."

Computrol, Inc. announces that it will exhibit in booths #200 and #202 at the upcoming AmCon Design & Contract Manufacturing Expo, September 14-15, 2010, at the Salt Palace Convention Center in Salt Lake City, Utah.

Nordson DAGE, a division of Nordson Corporation and the industry leader in X-ray inspection technology, is pleased to announce that its award-winning XD7600NT100HP X-ray inspection system will be exhibited in Booth 301 at the SMTA International Electronics Exhibition and Conference scheduled to take place on 26 - 27th October 2010 in Orlando, Florida.

In this study, the authors research low-residue and lead-free flux structures, identify solvent compositions that will dissolve these residue types and offer options for performing both bulk and site-specific ionic cleanliness testing methods. Don't miss Part II of this exciting research.

Many a company has learned the hard way that product reliability is directly related to the ionic cleanliness of a circuit board. In this study, the authors research low-residue and lead-free flux structures, identify solvent compositions that will dissolve these residue types and offer options for performing both bulk and site-specific ionic cleanliness testing methods.

"Our outstanding performance in the quarter clearly demonstrates that we are winning in the marketplace, capturing returning demand and serving our customers with a more efficient model," said Nordson President and Chief CEO, Michael F. Hilton. "The global team has been very prudent in managing expenses while continually meeting our customers' expectations."

Interconnect separation is usually expressed as a crack that propagates at the internal interconnection. This failure mode produces a crack that is wedge-shaped, with the large end on the side of the foil closest to the middle of the PWB. An interconnect failure frequently develops slowly over time, accumulating damage at a constant rate after onset.

Werner Engelmaier, noted author and expert in all things reliability, discusses reliability issues related to lead-free and RoHS. He notes three failure modes he's seeing more of: Pad cratering, trace lifting/buckling and "eyebrow" cracking. Adjusting board cooling rates can help tackle such issues, but, sometimes, that's not enough.

This paper outlines the process associated with soldering stacked packages using dip flux and dip solder pastes specifically designed to overcome the incidence of package warp. Based on the process issues involved, inspection results are presented to better illustrate the challenges in implementing PoP into production.

Computational tools that render digitally processed images in pseudo-color can enable inspectors to recognize soldering defects, such as lifted leads and cold solder, in SMT mounting processes. With enhanced images, comparative evaluations to determine cases of defects or no defects are easily accomplished.

The popularity of HDI is rising. Solder jet printing and cold attachment rival traditional solder printing. Manufacturers are building smaller and smaller quantities--even batches of one! What does this all mean for traditional AOI? Part II of this paper discusses the strengths and weaknesses of AOI given significant changes in PCB materials and manufacturing methods.

In this study, the authors research low-residue and lead-free flux structures, identify solvent compositions that will dissolve these residue types and offer options for performing both bulk and site-specific ionic cleanliness testing methods. Don't miss Part II of this exciting research.

Many a company has learned the hard way that product reliability is directly related to the ionic cleanliness of a circuit board. In this study, the authors research low-residue and lead-free flux structures, identify solvent compositions that will dissolve these residue types and offer options for performing both bulk and site-specific ionic cleanliness testing methods.

Interconnect separation is usually expressed as a crack that propagates at the internal interconnection. This failure mode produces a crack that is wedge-shaped, with the large end on the side of the foil closest to the middle of the PWB. An interconnect failure frequently develops slowly over time, accumulating damage at a constant rate after onset.

Werner Engelmaier, noted author and expert in all things reliability, discusses reliability issues related to lead-free and RoHS. He notes three failure modes he's seeing more of: Pad cratering, trace lifting/buckling and "eyebrow" cracking. Adjusting board cooling rates can help tackle such issues, but, sometimes, that's not enough.

Computational tools that render digitally processed images in pseudo-color can enable inspectors to recognize soldering defects, such as lifted leads and cold solder, in SMT mounting processes. With enhanced images, comparative evaluations to determine cases of defects or no defects are easily accomplished.

Trade shows and conferences are vital to the PCB assembly world. Where else can you meet so many potential customers and suppliers? Still, you can't make every industry event, and if you can’t be there, our Real Time With... video coverage is the next best thing to being there.

I-Connect007's Real Time with... has produced over 3,000 video interviews, conference presentations and product reviews at major events around the world. Past events include IPC APEX Expo, productronica, IPC Midwest, SMTA International, Mexitronica, NEPCON China and many more.

These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 6 includes images of solder splash, copper peaks, loose copper as well as other PCB defects that can cause problems at solder stencil printing.

These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 5 highlights bad design, mis-registration, bad mask definition, metal splash, and other via defects on PCBs.

IPC-A-610 is the universally accepted standard for electronics assembly defects. In this article Peter Krippner, Viscom AG, describes how IPC-A-610D is incorporated into post-reflow AOI systems to improve defect detection, reduce false calls, and eliminate missed defects during SMT assembly.

Interconnect separation is usually expressed as a crack that propagates at the internal interconnection. This failure mode produces a crack that is wedge-shaped, with the large end on the side of the foil closest to the middle of the PWB. An interconnect failure frequently develops slowly over time, accumulating damage at a constant rate after onset.