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NEWS
July 29, 2010
Research: Dirty Power Sources Gain More Support from Governments
Aegis Weapon System Verified During Navy Ship Trials in Korea
Wide Gap Between Support for Clean, Dirty Power Sources
America II Electronics Launches New Web Site
Motorola Posted $5.4B 2Q Sales
FEATURES
July 29, 2010
Teledyne Acquires Labtech Microwave
ASM Acquires Siemens Electronics Assembly Systems
Debasing Meaning of Value Demeans Common Good
The Challenges of PoP Devices During Assembly and Inspection
The Next Stage of Assembly: 3-D and Solder-Free
ARTICLES
July 29, 2010
New Column: PCB 101
Maintenance: A Team Partner or Black Hole?
Debasing Meaning of Value Demeans Common Good
The Next Stage of Assembly: 3-D and Solder-Free
Maxed Out: DIY Retro iPod Headphones
COLUMNS
July 29, 2010
New Column: PCB 101
Maintenance: A Team Partner or Black Hole?
Debasing Meaning of Value Demeans Common Good
The Next Stage of Assembly: 3-D and Solder-Free
Maxed Out: DIY Retro iPod Headphones
MOST READ
MOST EMAILED
TODAY
THIS WEEK
THIS MONTH
ASM Acquires Siemens Electronics Assembly Systems
Foxconn to Postpone Investments in Taiwan
Benchmark Electronics Reports 22% Sales Increase in Q2
Drop Test: Lead-Free Board After Assembly and Rework
Only in America: The World Versus Toyota
TODAY
THIS WEEK
THIS MONTH
The Challenges of PoP Devices During Assembly and Inspection
The Next Stage of Assembly: 3-D and Solder-Free
Celestica Posts Q1 Revenue Growth on New Contracts
Section 9: BGA Assembly X-Sections
Drop Test: Lead-Free Board After Assembly and Rework
TODAY
THIS WEEK
THIS MONTH
Creep Corrosion of OSP and ImAg PWB Finishes
Drop Test: Lead-Free Board After Assembly and Rework
Section 7: BGA Pads--Non-Metallic Contamination
Celestica Posts Q1 Revenue Growth on New Contracts
Rowland on RoHS 2 Draft Exemptions
TODAY
THIS WEEK
THIS MONTH
ASM Acquires Siemens Electronics Assembly Systems
A Study on Copper Dissolution in Liquid Lead-Free Solders Under Static and Dynamic Conditions
Flexible Thinking: Supporting Components on Flex Circuit Assemblies
TODAY
THIS WEEK
THIS MONTH
Digital Pseudo-Color Inspection Reveals Hidden Soldering Defects
Sanmina-SCI Meets Q3 Outlook; Up 34%
IPC Military Conference Highlights EMS Opportunities
ASM Acquires Siemens Electronics Assembly Systems
Jabil to Add 1,000 Employees in Hungary
TODAY
THIS WEEK
THIS MONTH
Creep Corrosion of OSP and ImAg PWB Finishes
Economic and Technical Advantages of Chemical Dross Elimination and Prevention
Digital Pseudo-Color Inspection Reveals Hidden Soldering Defects
Section 7: BGA Pads--Non-Metallic Contamination
Rowland on RoHS 2 Draft Exemptions
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BT Manufacturing Gains 14 New Customers
R&D Shifts to Universities
Zuken Leverages Capabilities at Aero Engineering
IPC: Battling for Science, Facts in EU Legislation
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OSI Systems Reports Strong Fiscal 3Q10 Results
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EDA Consortium Reports Sequential Fourth Quarter Gains
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DEK Unveils Untouchable Print Performance at APEX
Nortech's 2009 Sales Drop Reflects Weak Economy
Sypris Solutions to Release 4Q09 Results March 23, 2010
IDC: Market Rebound Will Drive Double-Digit Growth
Elcoteq Announces Management Changes
LPKF Expands Production Capacities for Laser Systems
The Designers Council: Your Design Connection
Jaltek IDMS Welcomes Garry Myatt as Sales Director
Mobile Phone Shipments Rebound in 4Q09; Up 11.3%
Elbit Systems Supplies Laser-Based Systems to Customers
Compal Expects to Remain Largest Notebook Maker in 1Q10
IntelligentMDx Receives Frost Award
Quanta Sees Record Revenue; Wistron Reports Drop
Zuken AwardsTouch Bionics at IET's 2009 Innovation Awards
LaBarge Secures $7.3 Million for TOW Weapon System
P.D. Circuits Promotes Andy D'Agostino to General Manager
ValuEngine Upgrades Flextronics' Rating
P. Kay Metal's MS2 Utilized by Jabil and Flextronics
Pulse Appoints Luscombe Distributor in Southern California and Baja
Incap to Extend Design Unit in India
ZigBee Alliance Enters Liaison Agreement
Dow Jones Economic Sentiment Indicator Rises to 35.5
Hughes to Provide Satellite Backhaul Services in Brazil
Letter re: Yeah, Ray, You Tell Them!
NI Reports 28% On-Year Revenue Drop in 2Q09
Northrop Grumman to Showcase Capabilities at BRIDEX 2009
Raytheon Receives Interoperable Network Gateway Contract
Mainstream MLC NAND Flash Remains Flat in 2H June
Wistron Issues GDRs to Fund Overseas Purchasing Activities
Worldwide Mobile Phone Market Declined 11.9% in 1Q09
Henkel Appoints Wise to Lead Global Sales Efforts
DYMAX’s Resilient Chip Encapsulants Provide Superior Protection
Rogers to Showcase HF Laminates at CTIA 2009
Hon Hai Shares Plunge After Weak 4Q08 Results
IDC: Worldwide Mobile Phone Market Declines by 12.6% in 4Q08
AT&S to Change Structure of Leoben, Styria Plant
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